Bondjet BJ820 Description

High Speed Fully Automatic Fine Wire Wedge Bonder

The Thin Wire Wedge Wedge Bonder Bondjet BJ820 is the latest development of Hesse & Knipps' wedge bonding innovation, responding to all wire bonding challenges on a single platform for a variety of applications such as RF and microwave devices, COB, MCM and hybrids, fibre-optics and automotive using aluminium wire, gold wire or ribbon. The BJ820 defines the benchmark in the industry for example by offering:

The fastest wiring speed of a wedge bonder
The largest work area
The greatest axis accuracy

Precision

1 μm at 3 σ axis repeatability
High precision touchdown detection without time delay
Precise control of bond force (1 cN)

Flexibility

Largest bonding area: 305 mm x 410 mm (12" x 16.1")
Can serve with two or more smaller bonding stations for efficient handling of smaller products or substrates, elimination indexing time and maximizing throughput (with indexers as well as manual loading)
Enables intelligent automation of extra large products

Speed

Up to 7 wires per second

Quality

Realtime bond quality monitoring system
Wear free and almost maintenance free piezo bondhead with solid state hinges
The PBS200 software supports control by host computer, product traceability and external statistical analysis
Process integrated Quality Control (PiQC) for advanced quality monitoring
E-Box: patented solution for optimized tool change

Small Footprint, Big Capability

Integrates easily into complex production lines

Process Advantages

Loop length: 70 µm up to 20 mm
Various loop form functions
- Constant wire length
- Constant loop height
- Individual loop shapes
Fine Pitch capability < 40 µm