Flipjet FJ520 Description
Ultrasonic Flipchip-Bonder
The FLIPJET FJ520 is the latest evolution of Hesse & Knipps flipchip bonder platform. The substantial experience of Hesse & Knipps in transducer development and ultrasonic technology, combined with the routine in building complex machines for fully automatic production has made this development possible. The FJ520 is designed with the flexibility for a wide range of applications and the possible requirements of future products in mind (e.g. 12").
Process advantages of ultrasonic flipchip technology
- Possible without underfill for some material combinations
- Monometallic connection with lowest possible electrical values for contact resistance, inductivity and capacity
- Finepitch possible down to 20 µm because bumps can not flow into each other
Precision
- Repeatability of the bonder axes ± 3 μm
- Recognition of "touchdown" without signal delay
- A total of 16 axes are controlled in synchronized motion
Productivity
- Cycle time approx. 1,0 - 1,2 s (without process time)
Quality
- Precisely controlled force- and ultrasonic output in up to 8 intervals
- Maintenance free bondhead with solid joints
Flexibility and process advantages
- Small footprint, big performance
- Integrates easily into complex production lines
Pattern recognition
- Application-oriented Hesse & Knipps image processing module
- 3 cameras (wafer-, handover- and bondhead camera)
- 2 programmable light sources per camera
- Alternative pattern recognition
Quality monitor
- Display of progression of bump deformation over time
- Display of progression of transducer current over time
User friendly software
- Graphical display of chip position over the substrate
- Visualization of taught reference systems
- Easy definition of multi-up program structures
- User access control in multiple hierarchy levels
