Bondjet BJ920 Description
Fully Automatic Heavy Wire Bonder
The Hesse & Knipps GmbH is the only supplier in the market who has designed a heavy wire bondhead with integrated pull test. The adjustment guidance by inspection camera (E-box) and the compatibility to the advanced quality control system PIQC further position the BJ920 in the market as the heavy wire bonder for highest quality requirements. The extra large working area and the resulting possibilities for automation qualify this bonder ideally for the markets of automotive electronics and power semiconductors.
Precision
- 10 μm at 3 σ repeatability at each position in the large work area
- Instantaneous recognition of "touchdown"-signal
- Precise force control with an accuracy of ±1 cN (static and dynamic)
Productivity
- High bond speed (application depending)
- 450 ms per wire (300 μm diameter, 8 mm loop length, 4 mm loop height)
- Parallel bond stations within workarea for throughput optimization
Quality
- E-box: patent-pending solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge
- Accurate positioning of the cutter and therefore repeatable precise and programmable cutting depth
- Active cutting system with increased cutter lifetime
- Precise output of force and ultrasonic in up to 3 intervals
- Robust bondhead with maintenance free solid joints
- Mechanical stiffness of the bondhead
=> reduced vibrations
=> high bond speed and best bond quality
Flexibility and process advantages
- Small footprint, big performance
- Integrates easily into complex production lines
- Minimum bond-to-bond distance <2 mm possible, maximum loop length only limited by workarea
- Fine pitch depending on wire diameter, e.g. <250 µm with 125 µm wire diameter
- Backcut or frontcut bondheads with active cutting system available
- Better access into tight packages as no "pusher" is needed
- Easy bondhead change in less than 15 minutes
- Flexible utilization of extra large workarea by multiple bond stations (manually loaded or automatic indexer)
Pattern recognition
- Application-oriented Hesse & Knipps image processing module
- Programmable illumination with 2 (standard) light sources
- Alternative pattern recognition
- Mini-CCD camera with OCIR Norm
Quality monitor
- Monitoring of wire deformation and transducer current and comparison against fixed target curves for detection of outliers and wire loss
- Integrated non-destructive pull-test programmable for every wire
- PiQC optional
User friendly software
- Portability of bond programs
- Graphical display of programmed wires
- Visualization of taught reference systems
- Free programmable loop shapes
- Easy definition of multi-up program structures
- User access control in multiple hierarchy levels
- Program change within seconds
- The software supports the connection to PLC/Host computer via Profibus
