Bondjet BJ915L Description

for Leadframe Applications

Hesse & Knipps is the only supplier in the market who has designed a Leadframe Bonder with integrated pull test. The adjustment guidance by inspection camera (E-box) and the compatibility to the advanced quality control system PiQC further position the BJ915L in the market as the Leadframe bonder for highest quality requirements. The modular design of the Leadframe indexer with the option to link it to a multiple head system and the optional additional camera for faster pattern recognition qualify this bonder ideally for the Leadframe market.

Advanced Leadframe Production

E-box: Patented solution for optimum calibration of the bond wedge and free programmable tolerance ranges for cutter, guide and wedge
High resolution quality control of wire deformation and transducer current
Program upload and download via LAN
Full automatic leadframe indexer

Quality

Integrated non-destructible pull test freely programmable for every wire
Quality monitoring by high resolution deformation and transducer current measurement
Quality test free programmable for each wire
Process integrated Quality Control (PiQC) for advanced quality monitoring

Speed

450 - 650ms (depending on application)

Precision

10μm at 3 σ repeat accuracy at every position within the working area
7μm pattern recognition system accuracy