Bondjet BJ820 Technical Data
Working area
- 305 mm x 410 mm (12" x 16.1")
- Z-axis stroke: 30 mm (1.2")
Mechatronic bondhead
- 45° Standard
- Deep Access optional
- 60° optional
Wire
- Al, Au: 17.5 μm - 60 μm (0.7 mil - 2.4 mil)
- Optional: 12.5 μm - 85 μm (0.5 mil - 3.3 mil)
Ribbon
- Al, Au: 6 μm x 35 μm (0.25 mil x 1.4 mil) up to 25 μm x 250 μm (1 mil x 10 mil) with the deep access bondhead
- Easy change-over from wire to ribbon
Positioning repeatability
- Axis repeatability 1 μm (0.04 mil) at 3 σ
Machine dimensions
- 2035 mm x 722 mm x 1250 mm (H x W x D)
- 80.1" x 28.4" x 49.2" (H x W x D)
Height of work area
- Height of bonding area over floor 960 mm according to SMEMA (37.8")
- Height over machine base plate 168 mm ± 1 mm (6.6")
Power supply
- 2,2 kW
- 230 V, 50-60 Hz, +8%, -10%
Compressed air
- 5 bar clean and dry (CDA)
- Dew point -35°C
- Filtered < 10 µm
Weight
- 1350 kg
