Bondjet BJ715/815 Description
Fully Automatic Wedge-Wedge Thin Wire Bonder
The BONDJET BJ715/815 with its large, easy to access working area and fast bondspeed offers highest flexibility for your bond processes. The effective process control and user friendly software are further highlights of the Thin Wire Wedge Bonder BJ715/815. The mechanical rigidity of the freely programmable and wear free bondhead guarantees less vibrations, resulting in high bond speed and better bond quality.
Quality
- Constant force- and ultrasonic power for highest requirements
- Wear free piezo bondhead
- Mechanical rigidity:
- reduced vibrations = higher bond speed and better bond quality
- True vertical wedge tool alignment without transducer pivot
Flexibility
- Extremely short to extremely long loops: 75 μm up to over 20 mm
- Fine Pitch: 40 μm
- Bondhead changeover in < 15 min.
- Optional Deep Access and 60° bondheads available
- Freely programmable
- Tail length, tear off and opening gap of the wire clamp
Positioning accuracy
- Repeated positioning 3 μm at 3 σ
- 180 ms per wire (2mm loop length, 45° wire feed angle, 1 wire)
Qualitiy control
- Continuos monitoring of wire deformation and transducer current within a programmable area of tolerance
- Control of the bond process in up to three freely programmable intervals
Userfriendly software
- Portability of bond programs
- Graphical visualisation of learned connections
- Graphical visualisation of reference systems
- Freely programmable shapes of wire loops
- Group and repeat capability
- Sophisticated hierachical user access control
- Program change in a few seconds
