PiQC
Process integrated Quality Control
The Hesse & Knipps GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market. A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process. PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.
Advantages for volume production
- Inspection of every bond
- No mechanical load of the bond connection
- Product specific configuration of the quality control system
Feedback from the process
- Mechanical oscillation of the wedge
- Friction at bond surface
- Transducer current
- Ultrasonic frequency progression
- Wire deformation
Quality statements by PiQC
- PiQC calculates a quality index for each bond based on the actual feedback signal from the process
- The signal related components of the quality index can be displayed graphically at any time
Teach mode for reference data
- Detailed automatic analysis of the welding process
- Extraction of process-specific reference data
