Welcome to Hesse & Knipps

Besides Fine and Heavy Wire Bonders and Ultrasonic Flipchip-Bonders Hesse & Knipps develops and manufactures standard and custom solutions for Automation.

• Fine Wire Wedge Bonder
• Ribbon Bonder
• Deep Access Bonder
• Heavy Wire Bonder
• Ultrasonic Flipchip-Bonder

Bondjet BJ820		Bondjet BJ93X		Flipjet FJ520
Fine Wire Bonder		Heavy Wire Bonder		Flipchip Bonder